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| MA4SW410B-1 HMICTM Silicon PIN Diode Switch with Integrated Bias Network RoHS Compliant M/A-COM Products V3 Features Broad Bandwidth Specified up to 18 GHz Usable up to 26 GHz Integrated Bias Network Low Insertion Loss / High Isolation Rugged, Glass Encapsulated Construction Fully Monolithic Description The MA4SW410B-1 device is a SP4T broadband switch with integrated bias network utilizing M/A-COM's HMICTM (Heterolithic Microwave Integrated Circuit) process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance with exceptional repeatability through low millimeter frequencies. Large bond pads facilitate the use of low inductance ribbon bonds, while gold backside metallization allows for manual or automatic chip bonding via 80/20 - Au/Sn, 62/36/2 - Sn/Pb/Ag solders or electrically conductive silver epoxy. Yellow areas denote wire bond pads Parameter Operating Temperature Storage Temperature Junction Temperature Applied Reverse Voltage Absolute Maximum -65oC to +125oC -65oC to +150oC +175oC 50V +30dBm C.W. 40mA 1 Applications These high performance switches are suitable for use in multi-band ECM, Radar, and instrumentation control circuits where high isolation to insertion loss ratios are required. With a standard +5V/-5V, TTL controlled PIN diode driver, 80nS switching speeds can be achieved. RF Incident Power Bias Current +25C Note: 1. Maximum operating conditions for a combination of RF power, D.C. bias and temperature: ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is * North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice. MA4SW410B-1 HMICTM Silicon PIN Diode Switch with Integrated Bias Network RoHS Compliant M/A-COM Products V3 MA4SW410B-1 (SP4T) Electrical Specifications @ TAMB = +25oC, 10mA Bias current Parameter Insertion Loss Frequency 6 GHz 12 GHz 18 GHz 6 GHz 12 GHz 18 GHz 6 GHz 12 GHz 18 GHz Minimum 40 35 30 Nominal 0.80 1.00 1.40 50 40 35 10 15 10 80 Maximum 1.0 1.2 1.6 Units dB dB dB dB dB dB dB dB dB ns Isolation Input Return Loss Switching Speed1 Note: 1.Typical switching speed measured from 10% to 90% of detected RF signal driven by TTL compatible drivers using RC output spiking network, R = 50 - 200 , C = 390 - 560pF. Operation of the MA4SW410B-1 Operation of the HMIC Series of PIN switches is achieved by the simultaneous application of negative DC current to the low loss port and positive DC current to the remaining isolated switching ports per the Driver Connections table below. The control currents should be supplied by constant current sources. For insertion loss, -10mA bias results in approximately -2V, and for Isolation ,+10mA yields approximately +0.9V at the respective bias nodes. The backside area of the die is the RF and DC return ground plane. Driver Connections CONTROL LEVEL (DC CURRENT) B2 -10mA +10mA +10mA +10mA B3 +10mA -10mA +10mA +10mA B4 +10mA +10mA -10mA +10mA B5 +10mA +10mA +10mA -10mA J1-J2 Low Loss Isolation Isolation Isolation CONDITION OF RF OUTPUT J1-J3 Isolation Low Loss Isolation Isolation J1-J4 Isolation Isolation Low Loss Isolation J1-J5 Isolation Isolation Isolation Low Loss ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is * North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice. MA4SW410B-1 HMICTM Silicon PIN Diode Switch with Integrated Bias Network RoHS Compliant M/A-COM Products V3 Typical RF Performance @ TAMB = +25C (Probed on Wafer) MA4SW410B-1 Typical Insertion Loss 0 MA4SW410B-1 Typical Isolation 0 -5 - 10 -1 - 15 - 20 -2 - 25 - 30 dB dB -3 -4 -5 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 - 35 - 40 - 45 - 50 - 55 - 60 - 65 - 70 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Frequency (Ghz) J1to J2 J1to J3 J1to J4 J1to J5 J1to J2 Frequency (GHz) J1to J3 J1to J4 J1to J5 MA4SW410B-1 Typical Return Loss 0 -5 - 10 dB - 15 - 20 - 25 - 30 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Frequency (GHz) Input RL J2 RL J3 RL J4 RL J5 RL ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is * North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice. MA4SW410B-1 HMICTM Silicon PIN Diode Switch with Integrated Bias Network RoHS Compliant M/A-COM Products V3 MA4SW410B-1 Schematic ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is * North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice. MA4SW410B-1 HMICTM Silicon PIN Diode Switch with Integrated Bias Network RoHS Compliant M/A-COM Products V3 MA4SW410B-1 Chip Outline Drawing1,2 I H I G F F A E E D D C C B DIM Mils MIN MAX Millimeters MIN MAX A B C D E F G H I RF Bond Pads (J1-J6) DC Bond Pads (B2-B5) Chip Thickness 85 89 106 110 48 52 7 11 33 34 57 61 77 81 46 50 24 28 7 X 5 REF. 5 X 5 REF. 5 REF. 2.17 2.27 2.69 2.79 1.22 1.32 0.17 0.27 0.85 0.86 1.46 1.56 1.96 2.06 1.18 1.28 0.61 0.71 .178 X .127 REF. .127 X .127 REF. 0.127 REF. Notes: 1. Topside and backside metallization is gold , 2.5M thick typical. ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is * North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice. MA4SW410B-1 HMICTM Silicon PIN Diode Switch with Integrated Bias Network RoHS Compliant M/A-COM Products V3 Wire/Ribbon and Die Attachment Recommendations Cleanliness These chips should be handled in a clean environment. Wire Bonding Thermosonic wedge wire bonding using 0.00025" x 0.003" ribbon or 0.001" diameter gold wire is recommended. A heat stage temperature of 150oC and a force of 18 to 22 grams should be used. Ultrasonic energy should be adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as short and straight as possible. Mounting The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder preform or conductive epoxy. Mounting surface must be clean and flat. Eutectic Die Attachment An 80/20, gold-tin, eutectic solder preform is recommended with a work surface temperature of 255oC and a tool tip temperature of 265oC. When hot gas is applied, the tool tip temperature should be 290oC. The chip should not be exposed to temperatures greater than 320oC for more than 20 seconds. No more than three seconds should be required for attachment. Solders containing tin should not be used. Epoxy Die Attachment A minimum amount of epoxy should be used. A thin epoxy fillet should be visible around the perimeter of the chip after placement. Cure epoxy per manufacturer's schedule. (typically 125-150oC). Ordering Information Part Number MA4SW410B-1 Package Waffle Pack ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is * North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice. |
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